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Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003in) thick, 99.99% (metals basis)

Name: Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003in) thick, 99.99% (metals basis)
SKU: ACM7440508-13
Rating: 5 (1 reviews)

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Catalog NumberACM7440508-13

CAS Number7440-50-8

CategoryAlloys

Copper Thinfoil, Oxygen-Free High Conductivity (OFHC), 0.008mm (0.0003in) thick, 99.99% (metals basis)

Description

Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid.

IUPAC Name

copper

Molecular Weight

63.55g/mol

Molecular Formula

Canonical SMILES

[Cu]

InChI

InChI=1S/Cu

InChI Key

RYGMFSIKBFXOCR-UHFFFAOYSA-N

Boiling Point

4703 °F at 760 mm Hg (NIOSH, 2016);2595 °C;2595 °C;4703°F;4703°F

Melting Point

1981 °F (NIOSH, 2016);1083 °C;1083 °C;1981°F;1981°F

Density

8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94

Solubility

Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble

Application

Copper Thinfoil, crafted from Oxygen-Free High Conductivity (OFHC) copper and measuring just 0.008mm thick, is designed to exploit copper's exceptional electrical and thermal conductivity, primarily for use in high-precision electronic applications. With a purity of 99.99% metals basis, this product is ideal for situations where minimal resistance and maximal heat dissipation are essential, such as in advanced electronics and circuitry. The thinness and purity of this copper foil allow for effective electron flow, making it a key element in enhancing performance and efficiency in devices requiring precise and reliable conductivity. Additionally, its malleability and strength at this microscopic thickness allow for its integration into complex technological architectures without compromising on structural integrity.

Color/Form

Reddish, lustrous, ductile, malleable metal;Red metal; cubic

Complexity

Covalently-Bonded Unit Count

EC Number

231-159-6

Exact Mass

62.929597g/mol

Formal Charge

Heat of Vaporization

1150 cal/g

Heavy Atom Count

ICSC Number

0240

Log P

-0.57 (calculated)

MeSH Entry Terms

Copper;Copper 63;Copper-63

Monoisotopic Mass

62.929597g/mol

Odor

Odorless /Copper dusts and mists/

Other Experimental

Lustrous, ductile, malleable metal; Mohs' hardness: 3.0; specific resistance: 1.673 microohm/cm; heat of fusion: 48.9 cal/g; heat capacity (solid): 0.092 cal/g/deg C at 20 °C, (liq): 0.112 cal/g/deg C; becomes dull when exposed to air; two naturally occurring isotopes: 63 (69.09%), 65 (30.91%); 9 artificial isotopes;Very slowly attacked by cold hydrochloric acid or dil sulfuric acid; readily by dil nitric acid, and by both not conch sulfuric acid and hydrobromic acid. It is also attacked by acetic acid and other organic acids.;COPPER FORMS TWO SERIES OF SALTS, CU(1+) AND CU(2+) BOTH VALENCE TYPES FORM COMPLEX IONS THAT ARE STABLE.;Ductile, excellent conductor of electricity. Complexing agent, coordination numbers 2 and 4. More resistant to atmospheric corrosion than iron, forming green layer of hydrated basic carbonate. Readily attacked by alkalies. Noncombustible, except as powder.;ELECTRONEGATIVITY (PAULING SCALE): 1.90;Dissolved readily in nitric acid and hot concentrated sulfuric acids slowly, but only when exposed to the atmosphere.

Rotatable Bond Count

RTECS Number

GL5325000

Stability

BECOMES DULL WHEN EXPOSED TO AIR. IN MOIST AIR GRADUALLY BECOMES COATED WITH GREEN BASIC CARBONATE.

UNII

789U1901C5

UN Number

3089;3077

Vapor Pressure

0 mm Hg (approx) (NIOSH, 2016);1 mm Hg @ 1628 °C;0 mmHg (approx);0 mmHg (approx)

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