What is the PubChem CID of Molybdenum boride?

The PubChem CID of Molybdenum boride is 82790.

What is the molecular formula of Molybdenum boride?

The molecular formula of Molybdenum boride is BMo.

What is the molecular weight of Molybdenum boride?

The molecular weight of Molybdenum boride is 106.76 g/mol.

What are the synonyms of Molybdenum boride?

The synonyms of Molybdenum boride are Molybdenum boride, Molybdenum boride (MoB), boranylidynemolybdenum, and Molybdenum monoboride.

When was Molybdenum boride created?

Molybdenum boride was created on August 8, 2005.

When was Molybdenum boride last modified?

Molybdenum boride was last modified on December 2, 2023.

What is the IUPAC name of Molybdenum boride?

The IUPAC name of Molybdenum boride is boranylidynemolybdenum.

What is the InChIKey of Molybdenum boride?

The InChIKey of Molybdenum boride is LGLOITKZTDVGOE-UHFFFAOYSA-N.

What is the Canonical SMILES representation of Molybdenum boride?

The Canonical SMILES representation of Molybdenum boride is B#[Mo].

What is the CAS number of Molybdenum boride?

The CAS number of Molybdenum boride is 12006-98-3.

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Molybdenum boride

Name: Molybdenum boride
SKU: ACM12006983-1
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Catalog NumberACM12006983-1

CAS Number12006-98-3

Category3D Printing Materials

Synonyms

5584AF; Molybdenum boride, powder, -325 mesh, 99.5% trace metals basis; 12006-98-3; Molybdenum boride (MoB); I14-55281; Molybdenum monoboride; EINECS 234-492-5; I14-99008;

IUPAC Name

boranylidynemolybdenum;

Molecular Weight

106.76g/mol

Molecular Formula

BMo;

Canonical SMILES

B#[Mo];

InChI

InChI=1S/B.Mo;

InChI Key

LGLOITKZTDVGOE-UHFFFAOYSA-N;

Application

Molybdenum boride serves as a crucial material in various high-performance applications due to its unique properties. As a refractory material, it stands out among several borides, including MoB, MoB2, Mo2B2, and Mo2B5, for its resilience in extreme conditions. Molybdenum boride is widely utilized in brazing to join metals such as molybdenum, tungsten, and tantalum, providing essential electronic and corrosion protection. Additionally, it is employed as a sputtering material with 99.5% purity to produce films that are both wear-resistant and semiconductive. This makes it an invaluable component in developing noncorrosive electrical connectors, switches, high-speed cutting tools, and abrasion-resistant machinery parts.

Complexity

Covalently-Bonded Unit Count

EC Number

234-492-5

Exact Mass

108.915g/mol

Heavy Atom Count

Monoisotopic Mass

108.915g/mol

Topological Polar Surface Area

0A^2

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