NAVIGATION
Bismuth Lead eutectic ingot, 99.9% (metals basis)
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Bismuth Lead Tin Cadmium eutectic ingot, 99.9% (metals basis)
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Lead Tin, solder alloy, 3.18mm (0.125in) dia
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Silver, solder alloy, 3.0mm (0.13in) dia
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Silver, solder alloy, 1.6mm (0.06in) dia
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Tungsten wire, gold plated, 0.025mm (0.001in) dia, W 99.95% (metals basis), Au 99.99%
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