CAS 7440-50-8 Copper Nanofoil - Materials / Alfa Chemistry

NAVIGATION

Copper Nanofoil

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Catalog Number

ACM7440508-8

CAS Number

7440-50-8

Product Name

Copper Nanofoil

Structure

Category

Metal

Synonyms

Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper

Description

Reddish lustrous malleable odorless metallic solid.;DryPowder; DryPowder, OtherSolid; DryPowder, PelletsLargeCrystals, WetSolid; DryPowder, WetSolid; Liquid; OtherSolid; OtherSolid, Liquid; PelletsLargeCrystals; PelletsLargeCrystals, OtherSolid;SOLID IN VARIOUS FORMS. TURNS GREEN ON EXPOSURE TO MOIST AIR.;Reddish, lustrous, malleable, odorless solid.;Reddish, lustrous, malleable, odorless solid.

IUPAC Name

copper

Molecular Weight

63.55g/mol

Molecular Formula

Canonical SMILES

[Cu]

InChI

InChI=1S/Cu

InChI Key

RYGMFSIKBFXOCR-UHFFFAOYSA-N

Boiling Point

4703 °F at 760 mm Hg (NIOSH, 2016);2595 °C;2595 °C;4703°F;4703°F

Melting Point

1981 °F (NIOSH, 2016);1083 °C;1083 °C;1981°F;1981°F

Purity

99.9%, 99.99%, 99.999%

Density

8.94 (NIOSH, 2016);8.94;Relative density (water = 1): 8.9;8.94;8.94

Solubility

Insoluble (NIOSH, 2016);8.96g/mL;Slightly sol in dilute acid;Slowly soluble in ammonia water;Solubility in water: none;Insoluble

Appearance

Reddish Metal

Color/Form

Reddish, lustrous, ductile, malleable metal;Red metal; cubic

Complexity

Covalently-Bonded Unit Count

EC Number

231-159-6

Electrical Resistivity

1.673 μΩ-cm @ 20 °C

Exact Mass

62.929597g/mol

Formal Charge

HeatOfFusion

13.26 kJ ·mol-1

Heat of Vaporization

1150 cal/g

Heavy Atom Count

ICSC Number

0240

Log P

-0.57 (calculated)

MDL Number

MFCD00010965

MeSH Entry Terms

Copper;Copper 63;Copper-63

Monoisotopic Mass

62.929597g/mol

Odor

Odorless /Copper dusts and mists/

Other Experimental

Lustrous, ductile, malleable metal; Mohs' hardness: 3.0; specific resistance: 1.673 microohm/cm; heat of fusion: 48.9 cal/g; heat capacity (solid): 0.092 cal/g/deg C at 20 °C, (liq): 0.112 cal/g/deg C; becomes dull when exposed to air; two naturally occurring isotopes: 63 (69.09%), 65 (30.91%); 9 artificial isotopes;Very slowly attacked by cold hydrochloric acid or dil sulfuric acid; readily by dil nitric acid, and by both not conch sulfuric acid and hydrobromic acid. It is also attacked by acetic acid and other organic acids.;COPPER FORMS TWO SERIES OF SALTS, CU(1+) AND CU(2+) BOTH VALENCE TYPES FORM COMPLEX IONS THAT ARE STABLE.;Ductile, excellent conductor of electricity. Complexing agent, coordination numbers 2 and 4. More resistant to atmospheric corrosion than iron, forming green layer of hydrated basic carbonate. Readily attacked by alkalies. Noncombustible, except as powder.;ELECTRONEGATIVITY (PAULING SCALE): 1.90;Dissolved readily in nitric acid and hot concentrated sulfuric acids slowly, but only when exposed to the atmosphere.

Ratio

0.34

Rotatable Bond Count

RTECS Number

GL5325000

Stability

BECOMES DULL WHEN EXPOSED TO AIR. IN MOIST AIR GRADUALLY BECOMES COATED WITH GREEN BASIC CARBONATE.

UNII

789U1901C5

UN Number

3089;3077

Vapor Pressure