What is the molecular formula of Boron Nitride dispersion?

The molecular formula of Boron Nitride dispersion is BN.

What is the molecular weight of Boron Nitride dispersion?

The molecular weight of Boron Nitride dispersion is 24.82 g/mol.

What is the IUPAC Name of Boron Nitride dispersion?

The IUPAC Name of Boron Nitride dispersion is azanylidyneborane.

What is the Canonical SMILES of Boron Nitride dispersion?

The Canonical SMILES of Boron Nitride dispersion is B#N.

What is the InChIKey of Boron Nitride dispersion?

The InChIKey of Boron Nitride dispersion is PZNSFCLAULLKQX-UHFFFAOYSA-N.

What is the CAS number of Boron Nitride dispersion?

The CAS number of Boron Nitride dispersion is 10043-11-5.

How many hydrogen bond donor counts does Boron Nitride dispersion have?

Boron Nitride dispersion has 0 hydrogen bond donor count.

How many hydrogen bond acceptor counts does Boron Nitride dispersion have?

Boron Nitride dispersion has 1 hydrogen bond acceptor count.

What is the exact mass of Boron Nitride dispersion?

The exact mass of Boron Nitride dispersion is 25.0123792 g/mol.

How many covalently-bonded unit counts does Boron Nitride dispersion have?

Boron Nitride dispersion has 1 covalently-bonded unit count.

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Boron Nitride Dispersion

Name: Boron Nitride Dispersion
SKU: ACM10043115-5
Rating: 5 (1 reviews)

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Catalog NumberACM10043115-5

CAS Number10043-11-5

Category3D Printing Materials

Description

DryPowder; DryPowder, OtherSolid; DryPowder, WetSolid, OtherSolid; OtherSolid

IUPAC Name

azanylidyneborane

Molecular Weight

24.82g/mol

Molecular Formula

Canonical SMILES

B#N

InChI

InChI=1S/BN/c1-2

InChI Key

PZNSFCLAULLKQX-UHFFFAOYSA-N

Purity

99.99%

Density

1.9-2.1 g/cm³

Application

Boron Nitride Dispersion is a versatile material engineered for a wide range of applications, capitalizing on its unique properties derived from its hexagonal and cubic forms. With an atomic structure that allows for exceptionally high thermal conductivity and chemical stability, Boron Nitride Dispersion is utilized extensively in high-temperature environments, such as furnace insulation and crucibles for melting metals like aluminum, boron, iron, and silicon. Moreover, it serves as a key component for dielectrics, diffusion masks, and passivation layers in the electronics industry. The dispersion finds further use in enhancing the self-lubricating properties of ceramics, alloys, resins, plastics, and rubbers, owing to its similarity to graphite in the hexagonal form while remaining a nonconductor. Its cubic form, known for remarkable hardness comparable to diamond, makes it an ideal abrasive for cutting tools, particularly in applications involving low-carbon ferrous metals. As an additive, Boron Nitride Dispersion also contributes to cosmetic, paint, and dental cement formulations, in addition to being fundamental in processes such as xerography, laser printing, and the production of oxygen sensors and proton conductors. Its non-toxic nature and ease of machining further expand its utility across diverse industrial sectors.

Average Particle Size

80-100nm

Complexity

Concentration

5.4 mg/L

Covalently-Bonded Unit Count

EC Number

233-136-6

Exact Mass

25.012379g/mol

Form

Liquid