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Germanium Nanoprisms

Catalog Number
ACM7440564-1
CAS Number
7440-56-4
Product Name
Germanium Nanoprisms
Structure
Category
Windows & Spheres
Description
PelletsLargeCrystals, WetSolid, OtherSolid
IUPAC Name
germanium
Molecular Weight
72.61
Molecular Formula
Ge
Canonical SMILES
[Ge]
InChI
InChI=1S/Ge
InChI Key
GNPVGFCGXDBREM-UHFFFAOYSA-N
Boiling Point
2830 °C
Melting Point
937 °C
Purity
99.9%, 99.99%, 99.999%
Density
5.323 @ 25 °C/4 °C
Solubility
INSOL IN WATER, HYDROCHLORIC ACID, DIL ALKALI HYDROXIDES;SOL IN HOT SULFURIC ACID, AQUA REGIA; INSOL IN ALKALI
Appearance
grayish-white
Application
Germanium Nanoprisms serve as a versatile component harnessing the unique properties of germanium, a metalloid known for its semiconductor capabilities and use in infrared applications. Derived as a by-product of processes like zinc smelting, germanium's ability to form stable +4 oxidation state compounds lends itself to advanced technological applications. The Germanium Nanoprisms capitalize on these characteristics, functioning well in the production of devices requiring infrared light transmission, such as lenses and windows in laser and infrared detection systems. Additionally, their semiconductor properties make them valuable in the fields of electronics, particularly for the creation of efficient rectifying devices like transistors and diodes. These nanostructures thus provide cutting-edge solutions in electronics and optical technologies, leveraging the high refractivity and dispersion of germanium-based materials for precision and performance.
Average Particle Size
70-120 nm
Color/Form
GRAYISH-WHITE, LUSTROUS, BRITTLE METALLOID; DIAMOND-CUBIC STRUCTURE WHEN CRYSTALLINE
Complexity
0
Covalently-Bonded Unit Count
1
EC Number
231-164-3
Exact Mass
73.921178g/mol
Formal Charge
0
Heat of Vaporization
3.5733X10+8 J/kmol @ melting point
Heavy Atom Count
1
MDL Number
MFCD00085310
MeSH Entry Terms
Germanium
Monoisotopic Mass
73.921178g/mol
Morphology
nearly spherical
Other Experimental
THERMAL EXPANSION COEFFICIENT AT APPROX 25 °C: 6.1X10-6 °C; THERMAL CONDUCTIVITY @ 25 °C: 0.14 CAL/SEC CM/DEG C; SPECIFIC HEAT (0-100 °C): 0.074 CAL/G/DEG C;LATTICE CONSTANT @ 25 DEG: 5.657X10-8 CM; VOL COMPRESSIBILITY: 1.3X10-12 SQ CM/DYN; DIELECTRIC CONSTANT: 16; MAGNETIC (MASS) SUSCEPTIBILITY (CHI X10+6)= -0.12;COVALENT BOND IONIZATION ENERGY @ 0 DEG K= 1.2 ELECTRON VOLT; BAND GAP: 0.67 ELECTRON VOLT; ATOMS/CC= 4.42X10+22; IMPURITY ATOM IONIZATION ENERGY: APPROX 0.01 ELECTRON VOLT; INTRINSIC RESISTIVITY @ 300 DEG K= 47 OHM-CM;ELECTRON MOBILITY @ 300 DEG K: 3900 SQ CM/V SEC; HOLE MOBILITY @ 300 DEG K= 1900 CM/V SEC; HOLE DIFFUSION CONSTANT @ 300 DEG K= 49;INTRINSIC CHARGE DENSITY @ 300 DEG K= 2.4X10+13; ELECTRON DIFFUSION CONSTANT @ 300 DEG K= 100;IS HIGHLY TRANSPARENT TO INFRARED LIGHT; HAS A HIGH INDEX OF REFRACTION;THE METAL & MANY OF ITS ALLOYS EXPAND ON SOLIDIFICATION;FIVE NATURALLY OCCURRING ISOTOPES: 70 (20.55%); 72 (27.37%); 73 (7.67%); 74 (36.74%); 76 (7.67%); ATOMIC NUMBER 32;POOR CONDUCTOR OF ELECTRICITY; VOL SMALLER BY FEW % WHEN MOLTEN; ATTACKED BY AQUA REGIA, CONCN NITRIC OR SULFURIC ACIDS, FUSED ALKALIES, ALKALI PEROXIDES, NITRATES, OR CARBONATES;HARDNESS 6 ON MOHS SCALE;Liquid molar volume = 0.013001 cu m/kmol determined at the triple point.;IG heat of formation = 3.766X10+8 J/kmol (ideal gas); for the crystal the enthalpy of formation is 0 at 298.15 K.;Heat of fusion at melting point = 3.18X10+7 J/kmol.
Particle Size
70-120 nm
Precautionary Statements
P210
Ratio
0.26
Rotatable Bond Count
0
RTECS Number
LY5200000
Signal Word
Danger
Stability
RELATIVELY STABLE, UNAFFECTED BY AIR, BECOMES OXIDIZED ABOVE 600 °C
True Density
5.323 g/cm³
UNII
619P6J82AE;00072J7XWS
UN Number
UN 3089 4.1 / PGII
Vapor Pressure
0 mm Hg @ 25 °C
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