High purity copper - Materials / Alfa Chemistry

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High purity copper

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ACMA00021078

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High purity copper

High-purity copper as a primary calibration material for elemental analysis

Scheme of the certification of matrix CRMs in relation to certified high purity materials. Matschat, Ralf, et al. Materials transactions 43.2 (2002): 90-97.

HR ICP MS in combination with laser ablation allows to examine the results of potential losses and contaminations during sample preparation. The calibration of this analytical method is complex for all direct solid sample techniques. Therefore, the results obtained are usually of a semi-quantitative character. On the other hand, elements that may have been lost by adsorption or evaporation as well as contaminations caused by wet-chemical sample handling and sample preparation can be well examined. Some researchers apply this method to analyze geological or organic materials using pressed pellets as samples. For ultrapure metals, the method has been successfully applied to ultrapure copper and will also be tested and applied to other materials.
Preparation of pressed pellets of copper powder (m5N, particle size about 5-10 μm) is necessary because the pure copper calibration sample set contains a large amount of the analyte of interest and very low (0.001 ... 100 mg/ kg) analyte mass fractions are not available. To achieve a suitable micro-homogeneity of the analytes in the pellets, doping with liquids is preferred over doping with powders containing the analyte compounds. Copper powder used as a basic material for the preparation of the pellets is very suitable for this purpose because its porous surface allows good adhesion of salt residues. During the doping process, the problem is that the acid contained in the solution cannot damage the porous particle surface to stabilize the analyte concentration. Therefore, the acid concentration was adjusted as low as possible and the drying time was kept short by heating the sample with infrared. Due to the short drying time, the formation of single crystals that do not adhere to the copper powder particles was avoided. This was confirmed by secondary ion mass spectrometry (SIMS) studies. The original copper particles and the doped copper particles were imaged at different magnifications using SEM. It is clear that neither additional grain clusters were formed nor the pore structure or the grain surface was damaged.

High-purity copper 3D printing

Schematics of a selective laser melting (SLM) machine

Copper has excellent properties such as good ductility, good corrosion resistance, and excellent electrical and thermal conductivity, and has been widely used in many fields. Although 3D printing can provide many advantages through layer-by-layer manufacturing, 3D printing of high-purity copper remains challenging due to thermal issues caused by copper's high electrical conductivity. There have also been recent advances in high-purity copper 3D printing technology in the past few years. There are also advantages and current problems in high-purity copper 3D printing methods, and the different properties of copper parts printed by these methods are summarized. There are also several potential applications for 3D printed copper parts, and these developments may lead to new improvements in this field of advanced manufacturing.
Selective Laser Melting Selective Laser Melting (SLM) is a widely used powder bed-based metal part manufacturing process. The build process starts with spreading a thin layer of metal powder over the work area. The metal powder is usually fed by a hopper, while a coating blade is used to ensure that the powder is evenly distributed. Then, a galvanometer scanner is used to guide a high-energy density laser beam through the deposited layers of metal powder. According to the CAD data of the manufactured part, only the metal powder in the selected area is exposed to the laser beam and melts and fills the XY plane along the part contour. The build platform is then lowered and a new layer of powder is deposited for the next laser scanning step. These three steps are repeated until the desired part is fully built. The build plate is usually connected to support structures, which are necessary for the fixation of the part in the powder bed and for heat dissipation. Deformation of the printed part can be avoided by preheating the build plate to reduce thermal gradients and reduce residual stresses during the SLM process. Inert gas such as nitrogen or argon is continuously supplied to the build chamber to provide an inert atmosphere to protect the metal powder and the heated metal part from oxidation. After the printing process is completed, the substrate can be removed from the printed part. Important process parameters such as layer thickness, infill spacing, laser power and scanning speed need to be optimized to produce high-quality printed parts.

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99.9%-99.9999%
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