RTM solution C - Materials / Alfa Chemistry

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RTM solution C

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Catalog Number

ACMA00016134

Product Name

RTM solution C

Category

Electronic Materials

Application

The RTM solution C is designed to facilitate the metallization of alumina substrates in various applications such as hybrid and microcircuits, insulated heat sinks, ceramic tubes, windows, and terminals. It effectively creates strong bond structures and forms hermetic seals. Additionally, RTM solution C is suitable for metallizing barium titanate, ferrites, and a variety of polymeric materials, including polyesters, epoxies, and ABS terpolymer, following appropriate etch modifications. This solution also supports the application of photolithographic technology with photoresist materials to accurately register metallization patterns, enabling the formation of conductive pads for thin film and hybrid circuits, as well as constructing capacitor base plates.

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