RTM solution B - Materials / Alfa Chemistry

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RTM solution B

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Catalog Number

ACMA00016135

Product Name

RTM solution B

Category

Electronic Materials

Application

The RTM solution B is designed to enhance metallization across various substrates, including alumina for use in hybrid and microcircuits, insulated heat sinks, ceramic tubes, windows, and terminals. It ensures the creation of robust bond structures and hermetic seals. Additionally, it facilitates the metallization of materials like barium titanate and ferrites, as well as a variety of polymers such as polyesters, epoxies, cellulosics, mylar, and ABS terpolymer, following necessary adjustments in the etching process (Solution A). Moreover, RTM solution B integrates effectively with photolithographic technology, utilizing photoresist materials to precisely define metallization patterns. This capability allows for the formation of conductive pads in thin film and hybrid circuits and the development of base plates essential for constructing capacitor structures.

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