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  • Polypropylene, melt index 0.5g/10min

  • Polypropylene, melt index 0.5g/10min

    Catalog Number
    ACM9003070-3
    CAS Number
    9003-07-0
    Product Name
    Polypropylene, melt index 0.5g/10min
    Structure
    Category
    Polymers
    Description
    Polypropylene is a tan to white odorless solid. Less dense than water and insoluble in water. Hence floats on water. (USCG, 1999)
    IUPAC Name
    12-[(2S,3R)-3-octyloxiran-2-yl]dodecanoic acid
    Molecular Weight
    354.6g/mol
    Molecular Formula
    C22H42O3
    Canonical SMILES
    CCCCCCCCC1C(O1)CCCCCCCCCCCC(=O)O
    InChI
    InChI=1S/C22H42O3/c1-2-3-4-5-11-14-17-20-21(25-20)18-15-12-9-7-6-8-10-13-16-19-22(23)24/h20-21H,2-19H2,1H3,(H,23,24)/t20-,21+/m1/s1
    InChI Key
    NSYDMBURIUSUDH-RTWAWAEBSA-N
    Density
    0.9 at 68 °F (USCG, 1999)
    Application
    Polypropylene, with a melt index of 0.5g/10min, serves as a versatile resin characterized by its low density and a well-rounded performance in thermal, chemical, and electrical applications, coupled with moderate intrinsic strength. Its properties can be further enhanced by the inclusion of reinforcing agents such as glass fiber. Although its heat resistance is not extensive, polypropylene is suitable for use in conditions involving boiling water or steam sterilization. Its chemical resistance is notable, as it remains unaffected by aqueous solutions of inorganic salts and mineral acids and bases, even at elevated temperatures, and shows resilience to most organic chemicals at room temperature. Exceptions to this resistance include attacks by halogens, fuming nitric acid, and active oxidizing agents at high temperatures. The material is translucent and autoclavable, and its characteristics can be augmented through compounding with fillers, blending with synthetic elastomers, and copolymerization with other monomers. Additionally, it improves pigment dispersion in films and fibers, serves as a modifier for waxes to reduce blocking, scuffing, and abrasion, and is used as a thermoplastic molding material. Its unique structural similarity to polyethylene enables it to be manufactured into thinner films, making it an effective replacement for paper in applications such as impregnated capacitors, where it also helps in reducing loss.
    Color/Form
    TRANSLUCENT WHITE SOLID
    Complexity
    316
    Covalently-Bonded Unit Count
    1
    Exact Mass
    354.313395g/mol
    Formal Charge
    0
    Heavy Atom Count
    25
    MeSH Entry Terms
    celgard
    Monoisotopic Mass
    354.313395g/mol
    Odor
    ODORLESS
    Other Experimental
    SOLID MATERIAL SOFTENS AT ABOUT 155 °C; KEEPS STRENGTH DOWN TO -100 °C /ISOTACTIC FORM/;SHRINKS IN BOILING TRICHLOROETHYLENE; GOOD RESISTANCE TO ABRASION (PILLING); TENDENCY TO DEVELOP STATIC CHARGES /ISOTACTIC/;DIFFICULT TO DYE, LACKS DYE-ATTRACTING POLAR GROUPS IN STRUCTURE; /ISOTACTIC FORM/;SHOCK RESISTANCE IS INTERMEDIATE BETWEEN THAT OF HIGH-IMPACT POLYSTYRENE & LOW-PRESSURE POLYETHYLENE;HAS HIGH CHEMICAL INERTNESS; PERMEABILITY TO WATER VAPOR IS VERY LOW;LIGHT IN WT, RIGID, SURFACE HARDNESS;MOLECULAR WT OF 40,000 OR MORE; TENSILE STRENGTH 5000 PSI; FLEXURAL STRENGTH 7000 PSI; USABLE UP TO 250 °F;GOOD ELECTRICAL RESISTANCE; LOW WATER ABSORPTION & MOISTURE PERMEABILITY; POOR IMPACT STRENGTH BELOW 15 °F;FAIR ABRASION & GOOD HEAT RESISTANCE IF PROPERLY MODIFIED; CAN BE CHROME-PLATED, INJECTION- & BLOW-MOLDED, & EXTRUDED;MP: 165 °C; DENSITY: 0.90-0.92; RESISANT TO ACID; ATTACKED BY STRONG OXIDIZING AGENTS, EG HYDROGEN PEROXIDE /ISOTACTIC/;DEGRADED BY HEAT & LIGHT UNLESS PROTECTED BY ANTIOXIDANTS; NOT ATTACKED BY FUNGI OR BACTERIA;RESISTS STRONG ACIDS & ALKALIES UP TO 140 °F; BUT IS ATTACKED BY CHLORINE, FUMING NITRIC ACID, & STRONG OXIDIZING AGENTS;HIGH TEMP RESISTANCE;SOLID MATERIAL /ISOTACTIC FORM/;PRACTICALLY INSOL IN COLD ORG SOLVENTS /ISOTACTIC FORM/;SOL IN HOT DECALIN & TETRALIN /ISOTACTIC FORM/;SOL IN BOILING TETRACHLOROETHANE /ISOTACTIC FORM/
    Rotatable Bond Count
    19
    Stability
    POOR RESISTANCE TO SUNLIGHT WHEN UNSTABILIZED /ISOTACTIC FORM/;OXIDIZES IN AIR @ HIGH TEMP
    XLogP3
    8.3
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