CAS 1785-64-4 Parylene f - Materials / Alfa Chemistry

NAVIGATION

Parylene f

PRICE INQUIRY

Catalog Number

ACM1785644

CAS Number

1785-64-4

Product Name

Parylene f

Structure

Category

Supramolecular Host Materials

Synonyms

Dimer,Parylene F;5,6,11,12,13,14,15,16-Octafluorotricyclo[8.2.2.24,7]hexadeca-4,6,10,12,13,15-hexaene;Parylene F Dimer

IUPAC Name

5,6,11,12,13,14,15,16-octafluorotricyclo[8.2.2.24,7]hexadeca-1(12),4(16),5,7(15),10,13-hexaene

Molecular Weight

352.22g/mol

Molecular Formula

C16H8F8

Canonical SMILES

C1CC2=C(C(=C(CCC3=C(C(=C1C(=C3F)F)F)F)C(=C2F)F)F)F

InChI

InChI=1S/C16H8F8/c17-9-5-1-2-6-11(19)15(23)8(16(24)12(6)20)4-3-7(13(9)21)14(22)10(5)18/h1-4H2

InChI Key

GUHKMHMGKKRFDT-UHFFFAOYSA-N

Density

1.497

Application

Parylene F serves as an advanced conformal coating solution designed to enhance the performance and longevity of electronic components, especially in high-temperature applications. Utilizing a vapor deposition process within a custom vacuum system, Parylene F forms a uniform barrier layer with thicknesses ranging from 2-50 microns, without the need for curing. This not only provides reliable protection against moisture, corrosive agents, and contaminants but also ensures waterproofing up to an IPX8 protection level, meeting stringent IPC, MIL, and NASA standards. Parylene F effectively prevents corrosion of printed circuit boards and electronic components, acts as a dielectric layer to protect against shorts and arcing, and mitigates tin whisker growth. It also offers thin film encapsulation to safeguard electronics from vibration or shock. Parylene F is uniquely capable of maintaining robust performance at elevated temperatures, thanks to its advanced material properties, although its use is restricted to medical devices and research and development applications.

Complexity

336

Covalently-Bonded Unit Count

Exact Mass

352.049826g/mol

Formal Charge

Heavy Atom Count

Monoisotopic Mass

352.049826g/mol

Rotatable Bond Count

XLogP3

5.2