Electroless nickel plating solution - Materials / Alfa Chemistry

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Electroless nickel plating solution

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Catalog Number

ACMA00016141

Product Name

Electroless nickel plating solution

Category

Electronic Materials

Application

The electroless nickel plating solution is designed to provide high-quality mechanical and electrical contacts for semiconductor devices, such as silicon rectifiers, solar cells, varactors, microwave diodes, transistors, and microcircuits. It enhances the quality of electrical contacts, particularly when the silicon surface undergoes abrasion by lapping to promote surface recombination velocity, is heavily doped through diffusion, or has low resistivity (0.1 ohm-cm). Moreover, this solution ensures strong adherence on surfaces like germanium, gallium arsenide, and cadmium sulfide. It also offers excellent solderability with lead, tin, and Pb/Sn alloys, and allows for flux-free soldering in hydrogen or non-oxidizing atmospheres. Comprehensive metallization procedures are available to achieve optimal nickel adhesion and superior ohmic contact quality in silicon rectifier and planar device fabrication.

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