Aluminum Etchant Type F - Materials / Alfa Chemistry

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Aluminum Etchant Type F

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Catalog Number

ACMA00016154

Product Name

Aluminum Etchant Type F

Category

Electronic Materials

Application

Aluminum Etchant Type F is used to precisely remove specific areas of aluminum metallizations deposited on silicon slices during semiconductor manufacturing. The process involves coating the silicon slice with aluminum up to 25,000 Å thick, applying a photoresist, and exposing it to UV light through a photographic mask to define the desired interconnections. In areas where the aluminum needs to be removed, the photoresist is developed, and Aluminum Etchant Type F is applied to achieve this selective etching. It's crucial to adjust the etching time based on both the etchant's temperature and the aluminum film's thickness, with higher temperatures required for thicker films to increase the etch rate. The proper balance ensures precise etching, followed by a water rinse to finish the process.

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