NAVIGATION


Aluminum Etchant Type D

Catalog NumberACMA00016155

CategoryElectronic Materials

Application
Aluminum Etchant Type D serves the essential purpose of selectively removing unprotected areas of vacuum-deposited aluminum metallizations on silicon slices, which can be as thick as 25,000 Å. After a photoresist application and UV exposure define the desired interconnections, the etchant precisely targets the unwanted aluminum without affecting the protected areas. This product is crucial for achieving accurate and efficient etching results, as the etching time can be precisely calculated based on the film thickness and the desired etch rate, which is influenced by the etchant temperature. With a higher etch rate needed for thicker films and a lower rate for thinner films, Aluminum Etchant Type D allows for meticulous control and adaptation to the specific requirements of each application, ensuring optimal performance in semiconductor fabrication.
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