NAVIGATION


Aluminum Etchant Type A

Catalog Number
ACMA00016157
Product Name
Aluminum Etchant Type A
Category
Electronic Materials
Application
Aluminum Etchant Type A is designed to precisely and efficiently remove unwanted aluminum from silicon wafers in semiconductor manufacturing, following the patterning of photoresist to define interconnection areas. The etchant is used to eliminate unprotected regions of aluminum after the deposition and exposure processes, playing a crucial role in circuit definition. The etching time, which varies according to the thickness of the aluminum layer and the selected etchant temperature, is essential for achieving the desired circuit pattern. For instance, thicker aluminum films necessitate a higher etch rate achievable at elevated temperatures, such as 80 ?/sec at 40°C, while thinner films can be etched at a slower rate, such as 30 ?/sec at 25°C, allowing for precise control over the etching process to ensure optimal results.
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