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Tetradecylphosphonic acid

Catalog Number
ACM4671754-2
CAS Number
4671-75-4
Product Name
Tetradecylphosphonic acid
Structure
Category
Self-Assembly Materials; Self Assembly and Contact Printing Materials
Synonyms
TPA, TDPA
Description
98%
IUPAC Name
tetradecylphosphonic acid
Molecular Weight
278.37 g/mol
Molecular Formula
C14H31O3P
Canonical SMILES
CCCCCCCCCCCCCCP(=O)(O)O
InChI
InChI=1S/C14H31O3P/c1-2-3-4-5-6-7-8-9-10-11-12-13-14-18(15,16)17/h2-14H2,1H3,(H2,15,16,17)
InChI Key
BVQJQTMSTANITJ-UHFFFAOYSA-N
Melting Point
80-85 °C
Flash Point
Not applicable
Application
TDPA can be used to cap copper nanoparticles to protect them from oxidation. It may also be used in the synthesis of cadmium sulfate (CdS) core, which can be used in the fabrication of cadmium selenium (CdSe)/CdS core quantum dots (QDs). It may also be coated on caesium lead Bromide (CsPbBr3) perovskite quantum dots for the development of White light emitting diodes (wLED).
Storage
2-8°C
Assay
98%
Complexity
213
Covalently-Bonded Unit Count
1
EC Number
225-118-1
Exact Mass
278.201082g/mol
Formal Charge
0
Heavy Atom Count
18
MeSH Entry Terms
tetradecyl phosphonate;tetradecyl-phosphonate
Monoisotopic Mass
278.201082g/mol
NSC Number
127409
Packaging
1 g/5 g/100 g
Rotatable Bond Count
13
XLogP3
5.1
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