Catalog Number
ACM4671754-2
Product Name
Tetradecylphosphonic acid
Category
Self-Assembly Materials; Self Assembly and Contact Printing Materials
IUPAC Name
tetradecylphosphonic acid
Molecular Weight
278.37 g/mol
Molecular Formula
C14H31O3P
Canonical SMILES
CCCCCCCCCCCCCCP(=O)(O)O
InChI
InChI=1S/C14H31O3P/c1-2-3-4-5-6-7-8-9-10-11-12-13-14-18(15,16)17/h2-14H2,1H3,(H2,15,16,17)
InChI Key
BVQJQTMSTANITJ-UHFFFAOYSA-N
Flash Point
Not applicable
Application
TDPA can be used to cap copper nanoparticles to protect them from oxidation. It may also be used in the synthesis of cadmium sulfate (CdS) core, which can be used in the fabrication of cadmium selenium (CdSe)/CdS core quantum dots (QDs). It may also be coated on caesium lead Bromide (CsPbBr3) perovskite quantum dots for the development of White light emitting diodes (wLED).
Covalently-Bonded Unit Count
1
Exact Mass
278.201082g/mol
MeSH Entry Terms
tetradecyl phosphonate;tetradecyl-phosphonate
Monoisotopic Mass
278.201082g/mol